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HANA Micron Inc.: Revision history

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22 September 2022

  • curprev 12:1012:10, 22 September 2022 >Nick 1,070 bytes +1,070 Created page with "== Summary<ref>Source: Yahoo Finance.</ref> == HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA, such as multi-chip PKG; lea..."
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