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LB Semicon Inc.: Revision history

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22 September 2022

  • curprev 05:2905:29, 22 September 2022 95.149.241.133 talk 843 bytes +843 Created page with "== Summary<ref>Source: Yahoo Finance.</ref> == LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as tape carrier packages, chip on glass, and chip on films; solder bumps for various flip chip packages; Cu pillar bumps; gold RDL, which is used to reposition the layout of the I/O pad;..."
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