HANA Micron Inc.

Summary

HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA, such as multi-chip PKG; lead frame bases, including quad flat no lead, thin small outline, thin shrink small outline, and quad flat packages; and technology products. The company also offers test services comprising RF, SOC, analog, and logic test services; and test technical support and test auto loading management system services, as well as test equipment products. In addition, it manufactures and sells silicon cathodes, ingot, and rings used in semiconductor and solar industries. The company was founded in 2001 and is headquartered in Asan, South Korea.