Summary[1] edit edit source
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. Its products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. The company also offers substrate-based package, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is based in Kaohsiung, Taiwan.
References and notes edit edit source
- ↑ Source: Yahoo Finance.