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Thermal copper pillar bump English (Q7783038)

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Language Label Description Also known as
British English
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    Microsoft Academic ID
    125619702
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    Freebase ID
    /m/03y1whf
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    instance of
    technology
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    production process English
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    subclass of
    Q131313 (Deleted Item)
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    heat sink English
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    uses
    Peltier effect English
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    used by
    Q432439 (Deleted Item)
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    developer
    Delco Electronics English
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    Q17063707 (Deleted Item)
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